Malaysia's First Manufacturer of Structural Powder Metal Parts and Saw Wire

Saw Wire

Saw wire is considered to be a potentially higher technology as compared to the inner diameter (ID) saw. With wire saw technique, slicing process can achieve the following benefits :-

• Cost effective

• Keep kerf loss to the minimal

• Producing much thinner wafer

• High quality surface finish

At present, wire saw technique has been widely used in the microelectronics sector to slice silicon ingots into thin wafers and this technique has also found its application in other materials.

Part Applications

  Powder Metallurgical Parts Applications Tecnology  |  Wire Saw Applications